Organic Electro-Luminescent Display Device

ABSTRACT

An organic EL display device includes an inorganic insulating film including a contact part as an opening where a contact electrode made of a conductive film is exposed, a TFT circuit layer provided on the inorganic insulating film and including a circuit including a thin film transistor, an organic EL element layer provided on the TFT circuit layer and including an organic EL element whose light emission is controlled by the circuit, and a sealing layer covering the organic EL element layer and made of an inorganic insulating material.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority from Japanese applicationJP2014-143016 filed on Jul. 11, 2014, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an organic EL display device and amanufacturing method of the organic EL display device.

2. Description of the Related Art

In recent years, an image display apparatus (hereinafter referred to as“organic EL display device”) using a self-luminous body called anorganic light emitting diode is put into practical use. Since theself-luminous body is used, as compared with a related art liquidcrystal display device, the organic EL display device is superior invisibility and response speed, and further, since an auxiliaryilluminating device such as a backlight is not required, furtherthinning is possible.

International Publication No. WO 01/08128A discloses an electro-opticaldevice in which a conductive member passing through one of twosubstrates of a liquid crystal panel is used, and the two substrates areelectrically connected. JP 2010-008677 A discloses a configuration inwhich a terminal electrode is formed in an opening formed on a firstsubstrate and overlapping an active driving element formed on the firstsubstrate, and the terminal electrode is electrically connected to aterminal of a wiring board.

SUMMARY OF THE INVENTION

In a thin display device such as an organic EL display device, reductionin size and weight is required, and the area of the outside of a displayarea, that is, the area of a so-called frame area is required to bereduced. In the display device as stated above, image display control isperformed by a driving integrated circuit element (driver IC (IntegratedCircuit)). However, since the driving integrated circuit element isgenerally mounted on the frame area on the same substrate on which thinfilm transistors are formed, it is difficult to reduce the area of theframe area of a portion where the driving integrated circuit element ismounted. Besides, there is also a case where the area of the frame areacan not be reduced because of mounting of an FPC (Flexible PrintedCircuits) or other electronic components in addition to the drivingintegrated circuit element. On the other hand, International PublicationNo. WO 01/08128A and JP 2010-8677 A disclose to provide the through holein the substrate as a base member. However, since a special high-costprocess is required, the application to a manufacturing process of adisplay device to be mass-produced is difficult.

The invention is made in view of the above circumstances, and an objectthereof is to provide an organic EL display device and a manufacturingmethod of the organic EL display device, in which a frame area can bereduced while the manufacturing cost is suppressed.

A typical organic EL display device and a manufacturing method of theorganic EL display device for solving the above problem are as follows.

(1) An organic EL display device includes an inorganic insulating filmincluding a contact part as an opening where a contact electrode made ofa conductive film is exposed, a TFT circuit layer provided on theinorganic insulating film and including a circuit including a thin filmtransistor (TFT), an organic EL element layer provided on the TFTcircuit layer and including an organic EL element whose light emissionis controlled by the circuit, and a sealing layer covering the organicEL element layer and made of an inorganic insulating material.

(2) In the organic EL display device of (1) above, the organic ELdisplay device further includes an electronic component including aterminal electrically connected to the contact electrode in the contactpart.

(3) In the organic EL display device of (2) above, the electroniccomponent is an FPC (Flexible Printed Circuit board).

(4) In the organic EL display device of (3) above, a driving integratedcircuit element for controlling the circuit is mounted on the FPC.

(5) In the organic EL display device of (3) above, the FPC includes anantenna wiring for performing non-contact communication with an externalcontrol equipment.

(6) In the organic EL display device of (3) above, the FPC includes asolid metal film having an area of 25% or more of a display area in planview.

(7) In the organic EL display device of (6) above, a touch panel isfurther provided on the sealing layer.

(8) In the organic EL display device of (3) above, the FPC includes theterminal, and the terminal of the FPC is electrically connected throughthe contact part provided in an outside frame area of the display area.

(9) In the organic EL display device of (8) above, the display isrectangular, the contact part includes a low referential potentialcontact part and a high referential potential contact part which receivesupply of potential difference required for light emission of theorganic EL element, at least one of the high referential potentialcontact part and the low referential potential contact part is providedat plural places, and is provided in the frame area corresponding to atleast two sides of four sides of the display area.

(10) In the organic EL display device of (8) above, the display area isrectangular, the contact part includes plural image signal contact partsto receive an image signal, and the image signal contact parts areprovided in the frame area corresponding to two opposite sides of therectangular display area.

(11) In the organic EL display device of (2) above, the electroniccomponent is a driving integrated circuit element.

(12) In the organic EL display device of (2) above, the terminal of theelectronic component is connected through an anisotropic conductivefilm.

(13) In the organic EL display device of (1) above, a part of thecontact electrode overlaps the display area in plan view.

(14) In the organic EL display device of (1) above, the contactelectrode overlaps the thin film transistor of the TFT circuit layer inplan view.

(15) In the organic EL display device of (1) above, the contactelectrode electrically connects plural electronic components to eachother.

(16) In the organic EL display device of (13) to (15) above, the contactelectrode contacts a conductive film extending from the TFT circuitlayer or the organic EL element layer through a contact hole.

(17) In the organic EL display device of (1) above, the TFT circuitlayer includes a signal distribution circuit to distribute an imagesignal inputted through a conductive film of the contact part to pluralwirings.

(18) In the organic EL display device of (1) above, a sealing substratebonded to the sealing layer and made of a transparent material isfurther provided.

(19) A manufacturing method of an organic EL display device includes aninterlayer separation film forming step of forming an interlayerseparation film on a substrate, an inorganic insulating film formingstep of forming an inorganic insulating film after the interlayerseparation film forming step, a circuit element forming step of forminga TFT circuit layer and an organic EL element layer including an organicEL element after the inorganic insulating film forming step, a substratepeeling step of peeling the substrate at the interlayer separation filmafter the circuit element forming step, and an electronic componentpressure-bonding step of pressure-bonding an electronic componentincluding a terminal to be electrically connected through a contact partwhere a contact electrode is exposed after the substrate peeling step.

(20) In the manufacturing method of the organic EL display device of(19) above, a sealing substrate bonding step of bonding a sealingsubstrate made of a transparent material onto the organic EL elementlayer through a sealing layer is further provided after the circuitelement forming step and before the substrate peeling step.

(21) In the manufacturing method of the organic EL display device of(19) above, an etching step of etching a part or a whole surface of apeeling surface to expose the contact electrode and to form a contactpart is further provided after the substrate peeling step.

(22) In the manufacturing method of the organic EL display device of(19) above, in the inorganic insulating film forming step, a conductivefilm which becomes the contact electrode is formed to be sandwiched inthe inorganic insulating film.

(23) In the manufacturing method of the organic EL display device of(19) above, a contact part forming step of forming a contact part byforming a conductive film which becomes the contact electrode is furtherprovided after the substrate peeling step and before the electroniccomponent pressure-bonding step.

(24) In the manufacturing method of the organic EL display device of(23) above, a conductive film exposing step of exposing a conductivefilm to be connected to the contact electrode by etching a whole surfaceof a peeling surface is further provided before the contact part formingstep.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view schematically showing an organic EL display device ofan embodiment of the invention.

FIG. 2 is a plan view schematically showing a front surface side of anorganic EL panel of FIG. 1.

FIG. 3 is a view showing an example of a pixel circuit of the organic ELpanel.

FIG. 4 is a schematic view for explaining a relation between each wiringand a contact part of FIG. 3.

FIG. 5 is a plan view schematically showing a back surface side of theorganic EL panel of FIG. 1.

FIG. 6 is a schematic view showing a section of a vicinity of a contactpart to which an FPC is connected.

FIG. 7 is a flowchart showing a manufacturing process of the organic ELdisplay device.

FIG. 8 is a flowchart showing a stacked structure in a sealing substratebonding step, a substrate peeling step and an electronic componentpressure-bonding step.

FIG. 9 is a view showing a modification of the plan view showing thefront surface side of the organic EL panel of FIG. 2.

FIG. 10 is a view showing a modification of the plan view showing theback surface side of the organic EL panel of FIG. 5.

FIG. 11 is a view showing a first modification of the section of thevicinity of the contact part of FIG. 6.

FIG. 12 is a view showing a second modification of the section of thevicinity of the contact part of FIG. 6.

FIG. 13 is a view showing a third modification of the section of thevicinity of the contact part of FIG. 6.

FIG. 14 is a view showing a fourth modification of the section of thevicinity of the contact part of FIG. 6.

FIG. 15 is a flowchart showing a manufacturing method of an organic ELdisplay device of the fourth modification of FIG. 14.

FIG. 16 is a view showing a configuration of a tablet terminal as aninformation processing apparatus including an organic EL display device.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the invention will be described withreference to the drawings. Incidentally, the disclosure is merely anexample, and modifications made within the spirit of the invention andeasily conceivable by one of ordinary skill in the art should fallwithin the scope of the invention. Besides, in the drawings, althoughwidths, thicknesses, shapes and the like of respective parts areschematically shown as compared with actual forms, they are merelyexamples and do not limit the interpretation of the invention. Besides,in the specification and the respective drawings, the same components asthose already described in the previous drawings are denoted by the samereference numerals and the detailed explanation thereof is omitted.

FIG. 1 schematically shows an organic EL (Electro Luminescent) displaydevice 100 of an embodiment of the invention. As shown in this drawing,the organic EL display device 100 includes an organic EL panel 200 fixedto be sandwiched between an upper frame 110 and a lower frame 120.Incidentally, the organic EL display device 100 is not limited to theform as stated above, and may be such that, for example, the organic ELpanel 200 is fixed by one frame.

FIG. 2 is a plan view schematically showing a front surface side, whichis an image display direction side, of the organic EL panel 200 ofFIG. 1. As shown in this drawing, the organic EL panel 200 includes arectangular display area 210 in which pixels 212 are arranged in amatrix form. Here, an example of a pixel circuit formed in each of thepixels 212 will be described with reference to FIG. 3.

As shown in FIG. 3, the pixel circuit includes an organic EL element 236as a light-emitting element connected to a cathode electrode 239 kept ata low reference potential, a drive transistor 234 one of a source and adrain of which is connected to an anode of the organic EL panel 236 andthe other of the source and the drain of which is connected to a highreferential potential line 231 kept at a high referential potential, apixel transistor 238 connected to a gate of the drive transistor 234 andapplying an image signal applied to an image signal line 233, a holdingcapacitor 237 formed between the gate of the drive transistor 234 andthe other of the source and the drain, and an additional capacitor 235formed between the anode and another constant potential. An operationexample of the pixel circuit will be described. First, an image signalapplied to the image signal line 233 is applied to the gate of the drivetransistor 234 at timing of ON/OFF of a scanning signal line 232. Theholding capacitor 237 holds the voltage of the image signal, and avoltage corresponding to the image signal is kept at the gate of thedrive transistor 234. A current corresponding to the voltage of theimage signal flows between the source and the drain, so that the organicEL element 236 emits light. Incidentally, FIG. 3 shows an example of thepixel circuit, and the configuration of the pixel circuit can besuitably modified.

FIG. 4 is a schematic view for explaining a relation between each wiringof FIG. 3 and a contact part (external connection terminal) forinputting and outputting a signal from and to the outside of the organicEL panel 200. As shown in this drawing, each of image signal lines 233is connected to an image signal line contact part 224 as a contact part255 (described later). The high referential potential is applied to thehigh referential potential line 231 through a scanning circuit 230 froma high referential potential contact part 222 as a contact part 255. Thescanning circuit 230 is a circuit to apply conduction potential forturning on between the source and drain of a scanning transistor insequence to the scanning signal line 232. A scanning circuit signal foroperating the circuit is inputted from a scanning circuit signal contactpart 223 as a contact part 255.

Return is made to FIG. 2. On the front surface side of the organic ELpanel 200, the scanning circuit 230 is arranged at a positioncorresponding to one side of the display area 210 in an outside framearea (outside area) 220 of the display area 210. The respective contactparts 255 are formed at positions corresponding to the frame area 220 onthe back surface side of the organic EL panel 200. Specifically, thescanning circuit signal contact part 223 is formed in the frame area 220close to the scanning circuit 230. The image signal line contact parts224 are arranged side by side in the frame area 220 corresponding to oneside parallel to a direction in which the image signal lines 233 arearranged, that is, one side extending perpendicularly to the one side ofthe display area 210 where the scanning circuit 230 is arranged. Theplural high referential potential contact parts 222 and plural lowreferential potential contact parts 221 connected to the cathodeelectrodes 239 are arranged along two adjacent sides where the imagesignal line contact part 224 and the scanning circuit 230 are notarranged. The high referential potential contact parts 222 and the lowreferential potential contact parts 221 may be alternately arranged, ormay be arranged in another sequence such as plural by plural.

Incidentally, the cathode electrodes 239 are formed on the whole surfaceof the display area 210 and supply common potential to the cathodes ofthe organic EL elements 236 of the respective pixels. The lowreferential potential contact parts 221 as the contact parts 255 tosupply potential to the cathode electrodes 239 and the high referentialpotential contact parts 222 to supply potential to the high referentialpotential lines 231 can be formed in the frame area 220 corresponding toat least two sides of the four sides of the display area 210. By doingso, more uniform potential can be supplied to the cathode electrodes 239of the respective pixels 212. Besides, voltage drop in the organic ELpanel 200 is suppressed, and power consumption of the organic EL displaydevice 100 is reduced, and further, luminance gradient can besuppressed.

Incidentally, the arrangement of the contact parts 255 is not limited tothe arrangement as stated above. The low referential potential contactparts 221 and the high referential potential contact parts 222 may notbe provided in the frame area 220 corresponding to at least two sides,and another arrangement may be adopted in which, for example, thecontact parts are not formed in the frame area 220, but formed in thedisplay area 210. Besides, the contact parts 255 are not limited tothose described above, and can be provided as necessary.

FIG. 5 is a plan view showing a back surface side of the organic ELpanel 200, and is a view showing a state where an FPC (Flexible PrintedCircuit board) 290 as an electronic component is attached to overlap theback surface of the organic EL panel 200. As shown in this drawing, theFPC 290 is pressure-bonded using an anisotropic conductive film (AFC) orthe like at the low referential potential contact parts 221, the highreferential potential contact parts 222, the image signal line contactparts 224 and the scanning circuit signal contact part 223, which arethe contact parts 255 of the organic EL panel 200. Incidentally, amounting component 292 and a drive IC (Integrated Circuit) 291 as anintegrated circuit to generate a signal to be applied to the contactpart 255 in a part of the organic EL panel 200 are mounted on the FPC290. Since the drive IC 291 is mounted on the FPC 290, the drive IC maynot be arranged in the frame area 220 of the organic EL panel 200, andthe frame area 220 can be made smaller. However, the mounting component292 and the drive IC 291 may not be mounted on the FPC 290. The FPC 290is connected to an external control equipment through an FPC connector295. Besides, a solid (continuous) metal film 293 having an area of 25%or more of the display area 210 maybe formed in the FPC. Heat diffusionefficiency can be raised by the formation of the solid metal film 293,and the temperature of the whole panel can be uniformed. Besides, sincethe metal film 293 becomes an electrostatic shield, rush-in noise fromthe external control equipment can be reduced. Especially, when a touchpanel is mounted, since the noise from the external control equipmentcan be shielded, the touch panel can be made to operate at high speedand with high accuracy. The potential of the solid metal film 293 may befloating and may not be connected to another, or may be fixed toconstant potential. In FIG. 5, although the solid metal film 293 isformed, the solidmetal film 293 may not be formed.

FIG. 6 is a schematic view showing a section of a vicinity of thecontact part 255 to which the FPC 290 is connected. As shown in thisdrawing, a terminal of the FPC 290 is connected to the contact part 255of the organic EL panel 200 through an anisotropic conductive film 252.Here, the anisotropic conductive film 252 is pressure-bonded to coverthe whole surface of the contact part 255. However, in the drawing, onlythe arrangement is simply shown for explanation. The organic EL panel200 includes an inorganic insulating film 251 made of SiN, SiO or thelike, a TFT circuit layer 260 including a circuit including a thin filmtransistor (TFT) 263 formed on the inorganic insulating film 251, anorganic EL element layer 270 formed on the TFT circuit layer 260 andincluding the organic EL element 236 whose light emission is controlledby the circuit of the TFT circuit layer 260, a sealing layer 281 formedon the organic EL element layer 270, made of an inorganic film of SiN orthe like and interrupting the intrusion of moisture from the outside, anadhesive layer 282 made of a transparent organic material, and a sealingsubstrate 283 made of a transparent insulating material such as glass orplastic. Here, the contact part 255 is formed such that a contactelectrode 253 is exposed in an opening of the inorganic insulating film251. Although the contact part 255 is formed in the frame area 220 asshown in this drawing, the contact part 255 may be formed in the displayarea 210. Besides, low-temperature polysilicon, amorphous silicon, oranother semiconductor material can be used as the semiconductor of theTFT circuit layer 260. Besides, the intrusion of moisture into theorganic EL element layer 270 may be prevented by another configurationin which the sealing layer 281, the adhesive layer 282 and the sealingsubstrate 283 are not used.

Incidentally, in this drawing, the thin film transistor 263 is arrangedas an example of the thin film transistor 263 formed in the TFT circuitlayer 260 and does not limit the circuit configuration, and another thinfilm transistor arrangement can be suitably used. Besides, the contactelectrode 253 may be connected to one of electrodes of the thin filmtransistor, or may be directly connected another electrode or anotherwiring, like the high referential potential contact part 222 or the lowreferential potential contact part 221. Besides, although the sealingsubstrate 283 may have a configuration including color filters formed inthe respective pixels 212, the color filter may not be included.Besides, in the example, although the case is shown in which theterminal of the FPC 290 is connected to the contact part 255 of theorganic EL panel 200, a terminal of another electronic component such asa semiconductor integrated circuit element may be connected. As statedabove, according to the embodiment, since the electronic component canbe directly disposed on the back surface side of the organic EL panel200 without providing a hole in the substrate, the manufacturing cost issuppressed, and the organic EL display device including the smallerframe area 220 can be provided.

FIG. 7 is a flowchart for explaining a manufacturing process of theorganic EL display device 100. As shown in the flowchart, first, atinterlayer separation film forming step S101, an interlayer separationfilm 289 is formed on a substrate 288 made of an insulating material.The interlayer separation film 289 is a film for separating a filmformed on the interlayer separation film 289 in a later step from thesubstrate 288, and a material may be suitably selected including awell-known material. Next, at inorganic insulating film forming stepS102, an inorganic insulating film made of SiN, SiO or the like isformed. The inorganic insulating film may be used later as the inorganicinsulating film 251, or may be an inorganic insulating film differentfrom the inorganic insulating film 251 as shown in a fourth modificationof FIG. 14 described later.

Thereafter, at circuit element forming step S103, the TFT circuit layer260 including the TFT circuit and the organic EL element layer 270including the organic EL element are formed. At the circuit elementforming step S103, a conductive film in contact with the inorganicinsulating film 251 through a contact hole may be formed. Whennecessary, the sealing layer 281 made of a material such as SiN or SiOis formed on the organic EL element layer 270, and the sealing substrate283 made of a transparent material is bonded at sealing substratebonding step S104. A state of a stacked structure after the sealingsubstrate bonding step S104 is shown by S104 of FIG. 8.

Thereafter, as shown in FIG. 8, at substrate peeling step S105, thesubstrate 288 is separated by the interlayer separation film 289. Afterthe separation, for example, at etching step S201 of FIG. 7, apart atthe contact electrode 253 of the peeling surface is etched to expose thecontact electrode 253, and the contact part 255 can be formed. However,the contact part 255 can be formed without using the etching step S201,and in this case, another step can be used. Finally, at electroniccomponent pressure-bonding step S106, a terminal of an electroniccomponent such as the FPC 290 and the contact part 255 arepressure-bonded using the anisotropic conductive film 252 and the like.Thereafter, a frame and the like are attached to the completed organicEL panel 200, so that the organic EL display device 100 is formed.

As described above, according to the manufacturing method of theembodiment, since the electronic component can be directly arranged onthe back surface side of the display device without using a high costprocess, the manufacturing cost is suppressed, and the organic ELdisplay device having a smaller frame area can be formed.

FIG. 9 shows a modification of the plan view showing a front surfaceside of the organic EL panel 200 of FIG. 2. As shown in this drawing, inthe modification, a signal distribution circuit 241 to distribute animage signal of a composite signal into an RGB image signal is arrangedin a frame area 220 corresponding to two opposite sides of a displayarea 210. Here, the signal distribution circuit 241 is a circuit formedin a TFT circuit layer 260 of the organic EL panel 200. Besides, asignal distribution circuit contact part 242, which is a contact part255 to receive a control signal to the signal distribution circuit 241from the outside, is formed near the signal distribution circuit 241.Since the number of image signal line contact parts 224 can be reducedby providing the signal distribution circuit 241, the manufacturingprocess can be simplified, and the yield can be improved. Besides, inthe modification of FIG. 9, the image signal line contact part 224 isformed in the frame areas 220 at the two places corresponding to the twoopposite sides of the rectangular display area 210. Since the imagesignal line contact part 224 is dispersedly arranged in the frame area220 of the two opposite sides, the arrangement density of the imagesignal line contact part 224 can be reduced, the manufacturing processis simplified, and the yield can be improved. Incidentally, in thismodification, although the signal distribution circuit 241 is provided,and the image signal line contact part 224 formed in the frame area 220at the two places corresponding to the two opposite sides is provided,only one of them may be provided.

FIG. 10 shows a modification of the plan view showing the back surfaceside of the organic EL panel 200 of FIG. 5. The modification isdifferent in that an antenna wiring 294 is arranged in an FPC 290. Theantenna wiring 294 is configured to perform input and output to and froman external control equipment via wireless communication similarly to anFPC connector 295. Accordingly, the number of terminals of the FPCconnector 295 can be reduced by providing the antenna wiring 294, themanufacturing process is simplified, and the yield can be improved.

FIG. 11 is a view showing a first modification of the section of thevicinity of the contact part 255 to which the FPC 290 of FIG. 6 isconnected. A different point from FIG. 6 is that an inorganic insulatingfilm 251 and a contact part 255 are formed on the same plane. Sinceother points are the same as those of FIG. 6, the description thereof isomitted. The inorganic insulating film 251 and the contact part 255 canbe formed on the same plane as shown in FIG. 11 in such a way that atthe inorganic insulating film forming step S102 of FIG. 7, the contactelectrode 253 is formed in the inorganic insulating film 251, and at theetching step S201, the whole surface of the peeling surface is etched toexpose the contact electrode 253. Even when the inorganic insulatingfilm 251 and the contact part 255 are formed on the same plane as statedabove, the same effects as those of the foregoing embodiment can beobtained.

FIG. 12 is a view showing a second modification of the section of thevicinity of the contact part 255 to which the FPC 290 of FIG. 6 isconnected. A different point from FIG. 6 is that a contact electrode 253is formed between inorganic insulating films 251, and a conductive filmextending from a TFT circuit layer 260 or an organic EL element layer270 contacts the contact electrode 253. By doing so, the area of acontact part 255 can be made large, and the yield at forming step of thecontact part 255 and at pressure-bonding step using an anisotropicconductive film 252 can be improved. In this case, the contact electrode253 can be formed to overlap a thin film transistor 263 in plan view. Inthis case, the area of the contact part 255 is made large, and thesemiconductor layer of the thin film transistor 263 can be shielded, andthe thin film transistor 263 can be stably operated. Besides, thecontact electrode 253 can be formed to overlap the inside of the displayarea 210 in plan view. In this case, the contact part 255 can be formedin not only the frame area 220 but also in the display area 210. Thus,the area of the contact part 255 is made larger, and the yield can beimproved. Here, the contact electrode 253 of FIG. 12 can be formed suchthat at the inorganic insulating film forming step S102 of FIG. 7, aconductive film which becomes the contact electrode 253 is formed to besandwiched between the inorganic insulating films 251.

FIG. 13 is a view showing a third modification of the section of thevicinity of the contact part 255 to which the FPC 290 of FIG. 6 isconnected. In this drawing, a contact electrode 253 includes twoelectrodes of a contact electrode 253A and a contact electrode 253B. Twoterminals of plural terminals of a drive IC 296 as an electroniccomponent are connected to respective contact parts 255 of the contactelectrode 253A and the contact electrode 253B through anisotropicconductive films 252. Besides, the contact electrode 253B is connectedto a terminal of an FPC 290 at another contact part 255 through ananisotropic conductive film 252. Like the contact electrode 253B, pluralelectronic components can be electrically connected to each other. Byadopting the configuration as stated above, the terminals of theelectronic components can be electrically connected on the back surfaceside of the display device without specially providing a wiringsubstrate or the like.

FIG. 14 is a view showing a fourth modification of the section of thevicinity of the contact part 255 to which the FPC 290 of FIG. 6 isconnected. Although the fourth modification has the same configurationas that of the second modification of FIG. 12, a manufacturing method isdifferent. FIG. 15 is a flowchart showing a manufacturing method of anorganic EL display device 100 of the fourth modification. A differentpoint from the flowchart of FIG. 7 is that conductive film exposing stepS207 and contact part forming step S208 are added between substratepeeling step S105 and electronic component pressure-bonding step S106.Since others are the same as the flowchart of FIG. 7, the similardescription is omitted. At the conductive film exposing step S207 afterthe substrate peeling step S105, the whole surface of the peelingsurface is etched, and a conductive film to be connected to the contactelectrode 253 is exposed. The exposure of the conductive film may beperformed by a process other than the whole surface etching, and thisprocess may not be performed. Next, at the contact part forming stepS208, a conductive film which becomes the contact electrode 253 isformed, and the contact part 255 is formed. The section of the fourthmodification can be formed by the manufacturing method including thesteps as stated above.

FIG. 16 is a view showing a configuration of a tablet terminal 500 as aninformation processing apparatus including the organic EL display device100 of the foregoing embodiment. The tablet terminal 500 includes theorganic EL display device 100 of the foregoing embodiment, aninput/output part 504 to perform input and output of a signal from andto hardware such as a wireless interface 505 including an antenna, amicro processor (MPU) 502 to process information from the input/outputpart 504 and to output display information to the organic EL displaydevice 100 as an output device, a memory to temporarily store processinginformation of the micro processor 502, and a power supply device 501 tosupply power to the hardware. Since the tablet terminal 500 includes theorganic EL display device 100, the tablet terminal 500 can be realizedin which the periphery of the display area 210 is a narrow frame areaand is superior in design.

While there have been described what are at present considered to becertain embodiments of the invention, it will be understood that variousmodifications may be made thereto, and it is intended that the appendedclaim cover all such modifications as fall within the true spirit andscope of the invention.

What is claimed is:
 1. An organic EL display device comprising: a firststack having an inorganic insulating film and a conductive film whichhas a contact part; a TFT circuit layer provided on the first stack, theTFT circuit layer includes a circuit including a thin film transistor(TFT) which is electrically connected with the conductive layer; anorganic EL element layer provided on the TFT circuit layer and includingan organic EL element whose light emission is controlled by the circuit;and a sealing layer covering the organic EL element layer and includingan inorganic insulating material.
 2. The organic EL display deviceaccording to claim 1, further comprising an electronic componentincluding a terminal electrically connected to the contact electrode inthe contact part.
 3. The organic EL display device according to claim 1,further comprising a touch panel on the sealing layer.
 4. The organic ELdisplay device according to claim 3, wherein the touch panel has asubstrate provided on the sealing layer via an adhesive layer.
 5. Theorganic EL display device according to claim 2, wherein the electroniccomponent is a driving integrated circuit element to control the organicEL element.
 6. The organic EL display device according to claim 1,wherein a part of the contact electrode overlaps the display area inplan view.